Packaging Materials Design Integration Engineer
Role
Manage packaging materials design rules for internal/external(customer) design guidance.
Lead design for manufacturing review, identify the gaps, and align with various teams to come up with final design for yield/reliability optimization.
Collaborate with simulation team to define/proceed thermomechanical and electrical simulation.
Provide summary of design hot spots for modification reference.
Qualifications
- 5 years+ experience with with semiconductor industry.
- Proven technical problem-solving skills.
- Engineering BS/MS/Ph.D.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.
Date:
Sep 27, 2024
Country/Region:
JP
City:
Tsukuba
Company:
TSMC Japan 3DIC RD Center,Inc.