ASIC Design Methodology & Flow Application Engineer (5620)

ASIC Design Methodology & Flow Application Engineer (5620)

Overview of Role

TSMC is in search of an ASIC Design Methodology & Flow Application Engineer at our design center in Austin, Texas. You will support customers on ASIC Physical Design Implementation on TSMC’s advanced process technologies (5nm/3nm/2nm/Angstrom-class nodes). You will report to the Sr. Director of our Design Solution Exploration & Tech Benchmarking Division. We are currently operating in a hybrid work schedule with 4 days in office.

Responsibilities

• Design implementation of industry benchmark designs to validate TSMC technology scaling capability.
• Engage in Design Methodology and flow support on advanced technology nodes (FinFET, nanosheet/GAA).
• Provide design flow support for TSMC customers in North America including training, issue resolution, and solution development/deployment.
• Root-cause design flow issues, Develop Innovative solutions for design and design methodology challenges, validate and document solutions, deploy to customers.
• Work closely with Design Flow team at company headquarters to gain a deep understanding of design methodology & flow, technology capabilities and constraints.
• Work closely with EDA vendors to understand/enhance tool capabilities as well as with TSMC customers to understand design requirements of their SoC products.

Minimum Qualifications

• MS or PhD in Electrical or Computer Engineering with coursework in VLSI, CAD, and/or Digital Design.
• 8+ years of hands-on experience on RTL2GDSII or supporting SoC designs for the same including converging and taping out multi-Ghz SoC design partitions with multiple power domains on leading edge process technology (7nm/5nm or more advanced).
• Be an expert user of Synopsys ICC2/DC/Fusion Compiler and/or Cadence Genus/Innovus with strong working knowledge of Tcl, experience creating/modifying techfiles, developing and/or customizing design flows in placement, CTS, routing to achieve an improved QOR, experience in creating and applying power domain (UPF/CPF) files.
• Must have intellectual curiosity to debug/root cause of difficult problems and strong problem solving skills with an innovative mindset.

Preferred Qualifications

• Good working knowledge of STA or physical verification using Synopsys/Cadence/Siemens tools are a plus.
• Strong customer orientation and good communication skills are highly desirable.

Company Description  

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

For positions requiring access to technical data subject to export control regulations, including Export Administration Regulations, TSMC North America may have to obtain export licensing approval from the U.S. Government for certain individuals.  All employment is contingent upon TSMC North America obtaining any export license or other approval that may be required by the U.S. Government.

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at G_Accomodations@tsmc.com. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case-by-case basis. 

Pay Transparency / Benefits statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $125,000 and $197,500 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location.  TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.