JASM - MFG Intelligent manufacturing engineer

In Manufacturing Department, we provide stable wafer production by maintaining equipment efficiency  and process quality (Service).

For example, we focus on production planning, equipment process order, and productivity improvement (Concrete action). By cooperating with module engineering department and process integration units (Target), we do our best in controlling delivery date, assisting equipment maintenance, and improving product quality (Work). These allow us to deliver high quality and standard products to our customers on time.

Responsibilities

（Immediately after hiring)
Your main responsibilities will include, but are not limited to:
1. Ensure that the core infrastructure of the factory can cooperate with the production execution system (Siview) and the material control system (MCS) operation. Improving productivity effectively and efficiently to meet organizational objectives.
2. Establish effective planning capabilities to maximize the fab capabilities to meet customer’s requirements.
3. Link the machine and the equipment integration application to collect data and status from the machine; and start to setup system for management and adjustment.
4. Create or maintain an effective scheduling system can provide decision-making logic to enable the fab to achieve production capacity targets, improve the operation control capability of the fab, and significantly reduce variability.
5. Responding quickly to change priorities and handling multiple projects with potentially overlapping deadlines.
6. Manage all members and building team spirit through involvement and effective communications. (Note: May need manage Direct Labors (DL) level/performance and building a team for production tools and product dispatching smoothly to support FAB wafer out target.)
7. Collaborating with the engineering teams to ensure that the robotic workstations, detection instruments, and database/ informatics tools meet goal committed to customer.  

(Scope of change)
There is a reassignment to the work specified by the Company.

Minimum Qualifications
1. A minimum of a B.S. degree in Industrial Engineering, Manufacturing, Production Engineering, Industrial Management, Computer Science, Mechanical and Automation Engineering or related fields. A Master and bachelor’s degree is preferred.
2. English: communication / conversational level, Japanese Ability: Native or Business level (N2 or above).
3. Demonstrated knowledge of optimization algorithm, IE, IT or related fields is required.
4. Enthusiastic and dedicated with the capability to motivate, lead and teach a team.
5. A team player that can multitask and thrive in a very dynamic and fast-paced environment.

Preferred Qualifications
1.Experience or knowledge of semiconductor manufacturing is a plus.

2. Chinese is a plus.

Working Conditions

1. There are 2 work types in MFG, which are Normal type and 4/2 shifting type. Employee needs be able to work in any types based on job assignment. 
Note: 4/2 shifting has Day shift (07:30-19:30) and Night shift (19:30 - 07:30). Continuous 3 days on duty and then continuous 3 days Off; Day and Night shifts will rotate after a scheduled period.

2. Benefits, Welfare - Health insurance, Employee pension, Employment insurance, Industrial accident compensation insurance, Pension plan, Retirement allowance plan, Annual leave, Commuting allowance: Actual expenses (maximum 50,000 yen/month), Housing allowance (In accordance with company's regulations)
3. Business Holiday - Saturdays, Sundays & Holidays, Vacation regulations：GW vacation, Summer vacation, Year-end and New Year vacations　※Follows the vacation regulations according to the company calendar
4. Recruitment Process - 2-3 interviews + Aptitude Test→ offer