Dry Etching Equipment Engineering Manager

Dry Etching Equipment Engineering Manager

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for a Dry Etch Equipment Engineer Manager to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Dry Etch Equipment Engineer Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

At TSMC Arizona’s Dry Etch department you’ll be responsible for new technology process transfer and matching to ensure successful Fab ramp to high volume manufacturing (HVM). Responsible for new tool installation / qualification / sustain in a green field Fab and rapidly deploy fleet to meet wafer output commitment.

Job Description:

Your main responsibilities include:

• Work with mother Fab ETC team to fingerprint all ETC tools to ensure seamless technology transfers.
• New production line set up and maintenance.
• Equipment troubleshooting.
• Resource planning, task prioritization, and related cross-function management work to move-in, install and qualify tools.
• Manage teams and work cross-functions to sustain ETC lines for tools.
• Manage teams and work cross-functions to continue improve the issues on ETC lines.
• Create and encourage a learning/sharing environment within your team and cross-function to develop talent.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

• B.S. (~10+ years exp.), Masters (~5-10+ years exp.) or Ph.D. (~3+ years exp.) in an Engineering or Physics-related field.
• Advanced operations and program management experience.
• Experience in silicon semiconductor manufacturing with exposure to and understanding of 22nm technology or below.
• RD or HVM experience in single wafer etching at 300mm semiconductor fabs (experience on AMAT/Hitachi/TEL/LAM tools is preferred).
• Previous experience in IDM (logic or memory) is preferred.
• Strong verbal and written communication skills in English.
• Demonstrated experience working with external and internal partners, including leading edge semiconductor equipment and/or materials manufacturers.
• A fast learner, able to adapt to culture and technology.
• Hands-on equipment experience with a strong sense of ownership.
• Willing to work in a clean room environment.

Personal Attributes:

• Must be a self-starter, highly organized, and have an ability to work independently across organizations.
• Demonstrated ability to communication complex problems through presentations and use of interpersonal persuasive skills.
• Must possess top-level business management, interpersonal, and facilitation skills.
• Desire for and demonstrated skill in leading and developing of persons and teams.

Work Location: Phoenix, AZ

Travel: NA