PVD Sr. Engineering Manager

Physical Vapor Deposition (PVD), Senior Engineering Manager

 

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. If you have the same passion to pursue excellence, you will find your fit here.

 

TSMC Arizona is looking for a PVD Sr. Engineering Manager to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a PVD Module Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

 

TSMC Arizona’s PVD Department is responsible for leading new technology transfers, new production line set up and maintenance and the quality and productivity improvement to ensure a smooth production operation.

 

Job Description:

Your main responsibilities include:

  • Elevate engineering and manufacturing excellence in the Physical Vapor Deposition department
  • Module process and equipment fundamental improvements
  • Innovate and seize opportunities for wafer quality and productivity improvement
  • Work with Process integration, Manufacturing, Yield improvement, and Cross-Module team to sustain high quality wafer production and delivery
  • Proactively identify talent and continuously develop team members with a deliberate road map
  • Sustain ownership of day-to-day operations
  • Equipment troubleshooting
  • Resource planning, task prioritization, and related cross-function management work.

 

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

  • Bachelor, Master or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or related field
  • 6+ years of experience in the semiconductor field, especially in module process development
  • Experience in the semiconductor industry with AMAT, TEL or ULVAC PVD/ Metal CVD or ALD 300mm tool process and equipment knowledge
  • Solid technical understanding of IC processing equipment, integrated flow, chemistry, and physics
  • Exhibit good and open communication skills, ability to work within cross-functional teams, including internal and external partners
  • Strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
  • Flexibility to change priorities and responsibilities to support business needs
  • Hands-on participant with a strong sense of ownership
  • Willing to work in a clean room environment
  • Must be willing to relocate to Taiwan for a 9 month period for training (major expenses paid)
  • Polished presentation and interpersonal skills
  • Good communication and negotiation skills
  • Quick assimilation to new technology

 

 

Work Location: Phoenix, AZ

Training Location: Taiwan

Travel: NA

Date:  May 1, 2024
Country/Region:  US
City:  Phoenix
Company:  TSMC Arizona


Nearest Major Market: Phoenix