Package Mechanical Solution Engineer - Mechanical Stress Design (DTCO) (7092)

Job Description

We are seeking a highly skilled and motivated Package Mechanical Solution Engineer to join our cutting-edge 3DIC (Three-Dimensional Integrated Circuit) design and integration team. The ideal candidate will have a strong foundation in mechanical engineering principles, semiconductor packaging, and system-level thermal/mechanical reliability, as well as a passion for innovation in advanced packaging solutions. This role will directly support TSMC’s competitive advantage by enabling better design rules, optimizing warpage, and ensuring customer projects succeed at advanced technology nodes. As a Package Mechanical Solution Engineer, you will be responsible for the design, simulation, optimization, and validation of mechanical and thermal solutions for next generation 3DIC technologies, with a particular emphasis on warpage analysis and design optimization.

Responsibilities:

• Design, analyze, and optimize package-level mechanical and thermal solutions for 3DIC applications, with specific ownership of warpage analysis and reduction strategies.
• Collaborate with cross-functional teams (R&D, QR, Product, and IIP) to define specifications and requirements for package reliability, performance, and design rule development.
• Perform structural, thermal, and stress simulations using industry-standard tools (e.g., ANSYS, COMSOL, CDNS) to ensure package integrity under operational and environmental conditions.
• Partner with EDA vendors to future-proof tools for TSMC design rules, enabling accurate warpage analysis and design rule exploration.
• Work closely with manufacturing teams to support package prototyping and assembly, providing analysis and recommendations to minimize yield risk due to mechanical stress or thermal effects.
• Provide early learning and feedback to customers on product-level warpage risks, supporting optimization and design improvements.
• Utilize advanced techniques to assess reliability risks such as electromigration (EM), IR-drop, thermal effects, warpage, and mechanical stresses.
• Develop and maintain documentation, including mechanical design specifications, test plans, and design reviews.
• Support post-fabrication validation and debugging efforts to ensure packages meet mechanical, thermal, and reliability requirements.
• Stay up to date with the latest industry trends, tools, and technologies in advanced packaging and mechanical solutions.

Required Skills:

• Master’s degree in mechanical engineering, Electrical Engineering, Materials Science, or a related field. Advanced degrees (Ph.D.) are preferred.
• At least 15+ years of experience in mechanical design, simulation, and optimization of semiconductor packaging solutions, preferably for 3DIC technologies.
• Strong understanding of thermal management, mechanical reliability, finite element methods (FEM), and stress analysis for electronic components, with proven warpage analysis expertise.
• Proficiency in simulation tools such as ANSYS, COMSOL, CDNS, or similar for thermal and structural analysis.
• Strong programming/automation background for EDA workflows (Python, Perl, Tcl, or similar).
• Excellent problem-solving and analytical skills with a focus on package-level solutions.
• Strong communication and teamwork abilities to effectively collaborate with cross-disciplinary teams and external partners (EDA vendors, universities, and research institutions).

Preferred Skills:

• Understanding of advanced packaging technologies such as 2.5D/3D, RDL (Redistribution Layers), or interposer design.
• Experience in reliability analysis techniques such as electromigration (EM), IR-drop, thermal and mechanical effects, and warpage analysis.
• Knowledge of design for manufacturability (DFM).
• Exposure to machine learning techniques for design optimization is a plus.

Location

Hsinchu preferred; San Jose option available with potential to build a small team.

Why This Role?

This role tackles the critical challenge of warpage in advanced 3DIC packaging, giving you direct impact on customer success, yield improvement, and the future design rules that keep TSMC the forefront of semiconductor innovation.

Why TSMC?

At TSMC, we are committed to staying at the forefront of semiconductor technology. By joining our team, you will contribute to shaping industry standards, collaborating with top global customers, and solving some of the most complex challenges in advanced packaging and integration. This role offers the opportunity to directly impact the competitiveness of both our customers and TSMC, while working in a highly collaborative, innovative environment.

Company Description  

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

1. The world’s leading dedicated semiconductor foundry
2. The technology leader with a strong reputation for manufacturing excellence
3. Advancing semiconductor manufacturing innovations to enable the future of technology

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

For positions requiring access to technical data subject to export control regulations, including Export Administration Regulations, TSMC North America may have to obtain export licensing approval from the U.S. Government for certain individuals.  All employment is contingent upon TSMC North America obtaining any export license or other approval that may be required by the U.S. Government.

Diversity statement

TSMC Technology, Inc. is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at G_ACCOMMODATIONS@TSMC.COM. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case-by-case basis. 

Pay Transparency / Benefits statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $153,500 and $250,000 per year . The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs. 

For roles hired outside of California, including other U.S. states or international locations such as Taiwan, compensation may vary in accordance with local market practices, legal requirements, and TSMC’s regional compensation framework.