Packaging Engineering Project Manager (Experienced Packaging Technologist)(5479)

Overview of Role

We are looking for an enthusiastic colleague with extensive experience and knowledge in packaging technology to join our Field Technical Solutions team in San Jose. This position entails collaborating with dynamic customers, North American Sales and TSMC Headquarters in Taiwan. Our mission is to enable customer to quickly and efficiently design their next generation of ‘must have’ products - by understanding their needs and then defining, promoting and enabling the best packaging solutions in our 3DFabric technology portfolio. You will report to the Director of the Field Technical Solutions-Advanced Packaging Department. Currently, we are operating in a hybrid work schedule with three days in the office.

Responsibilities

• Build relationships and trust with customers through technical interaction.
• Own the technical solution for customers and champion their needs.
• Justify the packaging business by understanding customers’ products, roadmaps, and technical needs in advanced packaging technologies.
• Identify and drive internals teams to develop competitive and creative technical solutions.
• Host the engagement meetings between customer and internal teams on engineering/technology discussions.
• Provide local technical support together with sales team to customers as required.
• Introduce/train customers on TSMC 3DFabric technology to enable them creating world class products.
• Ensure clear and accurate external and internal communication.

Minimum Qualifications

• Master’s Degree, or above, in Mechanical Engineering, Materials Science/Engineering, or Electrical Engineering.
• Proven, strong technical background with 13+ years of semiconductor packaging industry experience.
• Hands-on experiences of advanced packaging technologies, such as flip-chip assembly, BGA package, fan-out packages, WLCSP, 3DIC, heterogeneous packages, substrate technology, and other advanced packaging technologies
• Knowledge of chip-packaging interaction, assembly processes, thermo-mechanical behavior of packages and its materials, electrical performance requirements on packages, packaging design flow and concept including EDA tools, reliability/qualification tests and principles/requirements of functional/CP tests

Preferred Qualifications

• Experienced with packaging/assembly process development and production, substrate process and design, chip-package interaction and/or board-level reliability, package qualification and reliability tests
• Good communication skills and experienced in program/project management.
• Self-motivated with a desire to learn and engage.

Company Description

As a trusted technology and capacity provider, TSMC is driven by the desire to be:

• The world’s leading dedicated semiconductor foundry
• The technology leader with a strong reputation for manufacturing excellence
• Advancing semiconductor manufacturing innovations to enable the future of technology.

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence. The Company has continued to accelerate its R&D investment and staffing in recent years and is expanding its manufacturing footprint to support customer innovation with 3D IC technologies and optimal manufacturing capacity.

For positions requiring access to technical data subject to export control regulations, including Export Administration Regulations, TSMC North America may have to obtain export licensing approval from the U.S. Government for certain individuals.  All employment is contingent upon TSMC North America obtaining any export license or other approval that may be required by the U.S. Government.

Diversity statement

TSMC North America is committed to employing a diverse workforce and provides Equal Employment Opportunity for all individuals regardless of race, color, religion, gender, age, national origin, marital status, sexual orientation, gender identity, status as a protected veteran, genetic information, or any other characteristic protected by applicable law.

TSMC is an equal opportunity employer prizing diversity and inclusion. We are committed to treating all employees and applicants for employment with respect and dignity. If you require reasonable accommodation due to a disability during the application or the recruiting process, please feel free to notify us at G_Accomodations@tsmc.com. TSMC confirms to all applicants its commitment to meet TSMC’s obligations under applicable employment law. Reasonable accommodations will be determined on a case-by-case basis. 

Pay Transparency

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $121,500 and $190,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC’s total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.