パッケージ基板プロセスエンジニア／Packaging Substrate Process Engineer

Role

Manage advanced substrate technology development and pathfinding activities 
Define key technology building blocks to enable advanced package substrate architectures  
Lead suppliers to design/execute module DOE and come up with preliminary recipes  
Support substrate development engineer to improve supplier process robustness by driving CIPs
Explore new tools/processes for next-generation substrate requirements
 

Qualifications

5 years+ experience with packaging substrate industry
Familiar with substrate process/tools/materials
Knowledgeable of process development methodology
Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

About us

就業条件

・勤務地

茨城県つくば市　（変更の範囲）会社の定める範囲

・就業時間

月～金

9：00-18：00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険（労災）、確定拠出年金（マッチング拠出あり）、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等（但し、決算等の都合により、休日業務発生しますが、後日代休をご取得頂きます。）

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.