パッケージ基板設計DFMエンジニア／Packaging Substrate DesignDFM Engineer
Role
Manage substrate design rules for internal/external(customer) design guidance
Lead supplier DFM (design for manufacturing) review, identify the gaps and align with various teams to come up with a final design for yield/reliability optimization
Collaborate with the internal simulation team to define/proceed thermomechanical and electrical simulation (signal/power integrity) needs of each new tape-out. Provide a summary of design hot spots for layout modification reference Drive DFM efficiency improvement: simplify review flow or develop a new methodology
Support substrate development engineer to lead supplier engineering meetings
Qualifications
5 years+ experience with packaging substrate industry
Familiar with substrate design rules and design tools
Knowledgeable of substrate design and correlation to physical/electrical performances Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field
就業条件
・勤務地
茨城県つくば市 （変更の範囲）会社の定める範囲
・就業時間
月～金
9：00-18：00
・福利厚生
健康保険、厚生年金、雇用保険、労働災害補償保険（労災）、確定拠出年金（マッチング拠出あり）、退職金制度、年次有給休暇
・休日休暇
土日祝
夏季休暇、年末年始休暇、特別休暇等（但し、決算等の都合により、休日業務発生しますが、後日代休をご取得頂きます。）
会社カレンダーによる休暇制度に準ずる
・選考プロセス
書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.