次世代基板技術パスファインディングエンジニア／Next-Generation Substrate Technology Pathfinding Engineer

As a Next-Generation Substrate Technology Pathfinding Engineer, you will lead the exploration and development of next-generation semiconductor package substrate technologies in collaboration with Japanese equipment and materials manufacturers. This role requires expertise in various specialized areas, including insulation materials, solder materials, wet and dry processes such as plating and sputtering, laser via processing, and glass substrate technology. Candidates with a proven track record in these areas will be highly preferred. A Master's degree or higher in a relevant field is required.

Role:

• Lead the pathfinding efforts for next-generation semiconductor package substrate technologies, identifying key technical challenges and opportunities for innovation.
• Collaborate closely with Japanese equipment and materials manufacturers to leverage their expertise and resources in the development of advanced substrate technologies.
• Conduct research and development activities focused on insulation materials, solder materials, wet and dry processes, laser via processing, and glass substrate technology.
• Evaluate and optimize existing processes and materials, seeking improvements in performance, reliability, and cost-effectiveness.
• Drive collaborative development projects with suppliers and substrate manufacturers, establishing technical leadership and guiding the direction of the projects.
• Work closely with cross-functional teams, including Taiwan HQ, to ensure alignment of substrate technology development with overall business objectives.
• Stay informed about industry trends, technological advancements, and emerging materials and processes relevant to substrate technology development.
• Effectively communicate project updates, technical findings, and recommendations to stakeholders, including HQ teams and external partners.
• Foster a collaborative and inclusive team environment, prioritizing teamwork and knowledge sharing among team members.

Requirements:

• Master's degree or higher in materials science, chemical engineering, electrical engineering, or a related field.
• Extensive experience in the development of semiconductor package substrate technologies, with expertise in insulation materials, solder materials, wet and dry processes, laser via processing, and/or glass substrate technology.
• Strong communication skills, including proficiency in English and the ability to collaborate effectively with international partners.
• Proven ability to lead collaborative development projects with suppliers and substrate manufacturers, demonstrating technical leadership and driving successful outcomes.
• Excellent problem-solving skills and the ability to innovate and adapt to evolving technical challenges.
• Knowledge of industry standards and regulations related to semiconductor packaging and substrate technologies.
• Ability to work independently and as part of a cross-functional team, managing multiple projects and priorities simultaneously.
• Willingness to travel internationally as needed to support collaborative development efforts with Japanese partners.

About us
 

就業条件

・勤務地

茨城県つくば市　（変更の範囲）会社の定める範囲

・就業時間

月～金

9：00-18：00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険（労災）、確定拠出年金（マッチング拠出あり）、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.