Packaging Substrate Development Engineer

Role

Manage internal/external(customer) substrate test vehicle build, and execute substrate technology roadmap validation (DOE, process window validation and etc.) 
Responsible for full lifecycle health of new tape outs (NTO) and new product introduction (NPI). Ensure substrate on-time delivery and its outgoing quality/ reliability.
Direct interface with suppliers by leading engineering/operational meetings to track all the project readiness vs. setting targets/timelines. Provide a recovery plan for lagging tasks. Drive continuous process improvement and yield enhancement activities. 
Collaborate with suppliers and internal material research group to define next-generation packaging substrate needs of new materials – build up dielectrics, solder resist…
 

Qualifications

 

  • 5 years+ experience with packaging substrate industry
  • Good data analytic capability (statistics, DOE)
  • Proven records of technical program management and problem-solving
  • Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

About us

 

就業条件

・勤務地

茨城県つくば市 (変更の範囲)会社の定める範囲

・就業時間

月~金

9:00-18:00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険(労災)、確定拠出年金(マッチング拠出あり)、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等(但し、決算等の都合により、休日業務発生しますが、後日代休をご取得頂きます。)

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー

 

 

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.

日付:  2024/10/09
国/地域:  JP
市区町村:  Tsukuba
会社:  TSMC Japan 3DIC RD Center,Inc.