Packaging Substrate Process Engineer

Role

Manage advanced substrate technology development and pathfinding activities 
Define key technology building blocks to enable advanced package substrate architectures  
Lead suppliers to design/execute module DOE and come up with preliminary recipes  
Support substrate development engineer to improve supplier process robustness by driving CIPs
Explore new tools/processes for next-generation substrate requirements
 

Qualifications

5 years+ experience with packaging substrate industry
Familiar with substrate process/tools/materials
Knowledgeable of process development methodology
Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

 

About us

 

就業条件

・勤務地

茨城県つくば市 (変更の範囲)会社の定める範囲

・就業時間

月~金

9:00-18:00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険(労災)、確定拠出年金(マッチング拠出あり)、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等(但し、決算等の都合により、休日業務発生しますが、後日代休をご取得頂きます。)

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡Online面接1回➡Onsite面接2回(1日のうちに実施)➡オファー

 

 

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.

日付:  2024/10/09
国/地域:  JP
市区町村:  Tsukuba
会社:  TSMC Japan