Packaging Substrate Process Engineer

Role

Manage advanced substrate technology development and pathfinding activities 
Define key technology building blocks to enable advanced package substrate architectures  
Lead suppliers to design/execute module DOE and come up with preliminary recipes  
Support substrate development engineer to improve supplier process robustness by driving CIPs
Explore new tools/processes for next-generation substrate requirements
 

Qualifications

5 years+ experience with packaging substrate industry
Familiar with substrate process/tools/materials
Knowledgeable of process development methodology
Bac./Master/Ph.D. in Materials Science, Mech./Chem. Eng. or related Eng. field

 

About us
 

 

 

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.

Date:  Sep 10, 2024
Country/Region:  JP
City:  Tsukuba
Company:  TSMC Japan