Thermo-Mechanical Materials Characterization Engineer/QR Lab

Role:

  • Perform thermo-mechanical characterization of materials using DMA, TMA, TGA, DSC, Rheometer, and Tensile tools to evaluate properties such as thermal expansion, modulus, and viscosity.
  • Conduct physical analysis of semiconductor packages, including sample preparation for cross-sectional observation and observation using scanning electron microscopy (SEM).
  • Investigate process and material integrity, contributing to the development of defect analysis methodologies and solutions.
  • Serve as the owner of analytical instruments, performing routine maintenance, calibration, and troubleshooting as needed to ensure optimal performance.
  • Collaborate closely with the quality management department, reporting findings and contributing to quality control efforts for materials and processes at the Tsukuba facility.
  • Maintain open communication with HQ departments, providing updates on analysis results, equipment status, and quality management activities.
  • Contribute to the development and implementation of new analytical techniques and methodologies to enhance materials characterization capabilities.
  • Ensure compliance with safety protocols and regulations in all laboratory activities.

 

Requirements:

  • Bachelor's degree or higher in materials science, mechanical engineering, or a related field. Advanced degree preferred.
  • Extensive experience in thermo-mechanical materials characterization techniques, including DMA, TMA, TGA, DSC, Rheometer, and Tensile testing.
  • Proficiency in sample preparation techniques for cross-sectional observation and experience with SEM analysis.
  • Strong analytical and problem-solving skills, with the ability to troubleshoot and resolve technical issues related to analytical instruments and materials characterization.
  • Excellent communication skills and the ability to collaborate effectively with cross-functional teams.
  • Proven ability to manage multiple tasks and priorities in a fast-paced environment.
  • Experience with quality management systems and processes is a plus.
  • Willingness to engage in continuous learning and professional development to stay abreast of advancements in materials characterization techniques and semiconductor packaging technologies.

     

就業条件

・勤務地

茨城県つくば市 (変更の範囲)会社の定める範囲

・就業時間

月~金

9:00-18:00

・福利厚生

健康保険、厚生年金、雇用保険、労働災害補償保険(労災)、確定拠出年金(マッチング拠出あり)、退職金制度、年次有給休暇

・休日休暇

土日祝

夏季休暇、年末年始休暇、特別休暇等

会社カレンダーによる休暇制度に準ずる

・選考プロセス

書類選考➡面接3~4回➡オファー

 

 

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.

日付:  2024/04/25
国/地域:  JP
市区町村:  Tsukuba
会社:  TSMC Japan 3DIC RD Center,Inc.