Thermo-Mechanical Materials Characterization Engineer/QR Lab

Role:

  • Perform thermo-mechanical characterization of materials using DMA, TMA, TGA, DSC, Rheometer, and Tensile tools to evaluate properties such as thermal expansion, modulus, and viscosity.
  • Conduct physical analysis of semiconductor packages, including sample preparation for cross-sectional observation and observation using scanning electron microscopy (SEM).
  • Investigate process and material integrity, contributing to the development of defect analysis methodologies and solutions.
  • Serve as the owner of analytical instruments, performing routine maintenance, calibration, and troubleshooting as needed to ensure optimal performance.
  • Collaborate closely with the quality management department, reporting findings and contributing to quality control efforts for materials and processes at the Tsukuba facility.
  • Maintain open communication with HQ departments, providing updates on analysis results, equipment status, and quality management activities.
  • Contribute to the development and implementation of new analytical techniques and methodologies to enhance materials characterization capabilities.
  • Ensure compliance with safety protocols and regulations in all laboratory activities.

 

Requirements:

  • Bachelor's degree or higher in materials science, mechanical engineering, or a related field. Advanced degree preferred.
  • Extensive experience in thermo-mechanical materials characterization techniques, including DMA, TMA, TGA, DSC, Rheometer, and Tensile testing.
  • Proficiency in sample preparation techniques for cross-sectional observation and experience with SEM analysis.
  • Strong analytical and problem-solving skills, with the ability to troubleshoot and resolve technical issues related to analytical instruments and materials characterization.
  • Excellent communication skills and the ability to collaborate effectively with cross-functional teams.
  • Proven ability to manage multiple tasks and priorities in a fast-paced environment.
  • Experience with quality management systems and processes is a plus.
  • Willingness to engage in continuous learning and professional development to stay abreast of advancements in materials characterization techniques and semiconductor packaging technologies.
     

 

 

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, or disability.

Date:  Apr 25, 2024
Country/Region:  JP
City:  Tsukuba
Company:  TSMC Japan 3DIC RD Center,Inc.